You can individually adjust the pad's top & bottom paste mask & solder mask swell/shrink properties by: RIGHT CLICKING ON THE PAD selecting MASK / PASTE SETTINGS Note you are given the choice of modifying the Mask & Paste diameters for each layer independently. The drill bit will then drill away all of the copper on the bottom side. Quote from: DerekG on September 01, 2017, 10:57:34 pm Adjust the hole size of the pad to be larger than the bottom pad.
If you get a design rule error, simply add that copper annular ring to the same net as the pad. I suggest you just place it in an empty space on the top layer, adjust its diameter, then drag it (& centre it) over your existing pad. Increase the top side annular copper ring by using the "Drawing Menu" (locate by selecting VIEW, TOOLBARS, DRAWING) Make sure you are on the top side of the board Select SIGNAL/PLANE from the Drawing Menu Select "PLACE SHAPE" (which is 3 icons to the left of the SIGNAL/PLANE drop down menu) Select "FILLED ELLIPSE" from the drop down menu (you can drag the ellipse to a circle) You can now place an annular copper ring on the board. Adjust the hole size of the pad to be larger than the bottom pad.
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